123 English-speaking jobs in Villach

Communicates product specifications to suppliers and assesses supplier’s ability to meet engineering and quality requirements. Evaluates suppliers’ internal functions to assess their overall performance and provides feedback in assessment of their operation.

ResponsibilitiesResponsibility for dry etch semiconductor fabrication equipmentDevelop new dry etch processes for new materialsCollaborate with research teams within SAL to fabricate state of the art research vehiclesEnsure stable processes and equipment run for the dry etch departmentEvaluate new processes and equipmentStay current with industry advancements and emerging technologies in lithograp

Senior Scientist – Power Electronics Packaging & Characterization (f/m/d)Together with our team of Power Electronic experts you will lead R&D projects in various application areas of power converters.

Your future responsibilities Development of new dry etch processes for new materials with a state-of-the-art etching tool. Thin film surface characterization (incl. SEM, EDX, ellipsometry, AFM, XPS). Design and execution of advanced experiments, data analyses, and process improvements.

Infineon Automotive (ATV) is responsible for shaping the future of mobility. We make cars cleaner, safer and smarter. This specific job is mainly suitable for students within technical studies in the field of electronics, mechatronics, software engineering or similar. If you are looking to work in a dynamic environment within a highly motivated international team then apply now!

At Lam Research, we create equipment that drives technological advancements in the semiconductor industry. Our innovative solutions enable chipmakers to power progress in nearly all aspects of modern life, and it takes each member of our team to make it possible. Across our organization, our employees come to work and change the world. We take on the toughest challenges with precision and accuracy.

At Lam Research, we create equipment that drives technological advancements in the semiconductor industry. Our innovative solutions enable chipmakers to power progress in nearly all aspects of modern life, and it takes each member of our team to make it possible. Across our organization, our employees come to work and change the world. We take on the toughest challenges with precision and accuracy.

At Lam Research, we create equipment that drives technological advancements in the semiconductor industry. Our innovative solutions enable chipmakers to power progress in nearly all aspects of modern life, and it takes each member of our team to make it possible. Across our organization, our employees come to work and change the world. We take on the toughest challenges with precision and accuracy.

At Lam Research, we create equipment that drives technological advancements in the semiconductor industry. Our innovative solutions enable chipmakers to power progress in nearly all aspects of modern life, and it takes each member of our team to make it possible. Across our organization, our employees come to work and change the world. We take on the toughest challenges with precision and accuracy.

Your future responsibilities Following research topics are at this moment open and subject to be incorporated into several master thesis. A master thesis may incorporate more than one listed topics to a full thesis. For your application please refer to the code referenced with the set of topics.

You want to play a strategic role in both the development of design methodologies and software solutions within our Chip Package Board Co-Design team? You will be at the forefront of enhancing our design flows while also contributing significantly to software development projects.

You want to play a strategic role in both the development of design methodologies and software solutions within our Chip Package Board Co-Design team? You will be at the forefront of enhancing our design flows while also contributing significantly to software development projects.

You want to play a strategic role in both the development of design methodologies and software solutions within our Chip Package Board Co-Design team? You will be at the forefront of enhancing our design flows while also contributing significantly to software development projects.

You want to play a strategic role in both the development of design methodologies and software solutions within our Chip Package Board Co-Design team? You will be at the forefront of enhancing our design flows while also contributing significantly to software development projects.

You want to play a strategic role in both the development of design methodologies and software solutions within our Chip Package Board Co-Design team? You will be at the forefront of enhancing our design flows while also contributing significantly to software development projects.

You want to play a strategic role in both the development of design methodologies and software solutions within our Chip Package Board Co-Design team? You will be at the forefront of enhancing our design flows while also contributing significantly to software development projects.

You want to play a strategic role in both the development of design methodologies and software solutions within our Chip Package Board Co-Design team? You will be at the forefront of enhancing our design flows while also contributing significantly to software development projects.

You want to play a strategic role in both the development of design methodologies and software solutions within our Chip Package Board Co-Design team? You will be at the forefront of enhancing our design flows while also contributing significantly to software development projects.

You want to play a strategic role in both the development of design methodologies and software solutions within our Chip Package Board Co-Design team? You will be at the forefront of enhancing our design flows while also contributing significantly to software development projects.

You want to play a strategic role in both the development of design methodologies and software solutions within our Chip Package Board Co-Design team? You will be at the forefront of enhancing our design flows while also contributing significantly to software development projects.