48 English-speaking jobs in Styria

Technical Project Manager R&D will plan, steer, and implement technology-driven R&D projects, focusing on optical-integrated PCBs or IC substrates. Responsibilities include translating system requirements into technical specifications, coordinating stakeholders, and ensuring project excellence.

Configuration and Change Manager to support semiconductor development programs. Ensure full-lifecycle traceability, govern ECOs, and manage validation configurations using tools like Jira and Confluence. Requires 4+ years in CCM within the semiconductor sector.

Senior Backend Engineer (Python) to shape scalable backend architecture and develop features connecting hardware and software. Requires profound expertise in Python/Django, PostgreSQL, and RESTful APIs. Mentoring and agile experience are key.

Manage full-spectrum Austrian tax, including VAT, corporate income tax, and customs duties. Establish risk controls, handle audits, and optimize tax processes while tracking EU regulations.

Design and implement scalable data pipelines to process telemetry data from devices using Azure and Snowflake. Build data models and workflows to support analytics, applying engineering best practices. Requires 1+ years of data engineering experience with strong SQL and Python skills.

Senior Engineer R&D - Patterning Process develops circuit formation technologies for Glass Core Substrates. This role optimizes lithography, etching, and plating processes for high-density interconnect solutions. Requires 7+ years in microelectronic packaging or process technology.

Ensures high availability, stability, and security of enterprise Linux systems. Operates, maintains, and optimizes Linux platforms, including OS and kernel patching, performance tuning, and troubleshooting. Collaborates with global IT and infrastructure teams.

Senior Engineer R&D - Patterning Process develops advanced circuit formation technologies for Glass Core Substrates. Responsibilities include optimizing lithography, etching, and plating processes for high-density interconnect solutions. Requires 7+ years in microelectronic packaging or process technology.

Ensure reliable operation of industrial electrical and automation systems. Troubleshoot Siemens S7 PLCs, drives, and fieldbus networks. Requires technical education and experience with electrical schematics.

Junior Data Engineer to support data solution development and reliable data processing. Responsibilities include maintaining data pipelines, managing databases, and assisting with AI initiatives. Requires IT focus degree and basic programming skills in Python, Java, or C#.

Senior C++ Engineer specializing in hardware interfaces and systems programming. Responsibilities include shaping software architecture, implementing complex features, and mentoring team members within an agile framework. Requires profound C++ expertise.

Drive development and reliability enhancement of next-generation glass core substrate technologies. Lead design, evaluation, and qualification of packaging solutions, analyzing failure mechanisms. Requires 3+ years in reliability or packaging technology.

Principal Engineer R&D - Build-up Process develops next-gen build-up technologies for Glass Core Substrate applications. This role drives process innovation, optimizes technologies like lamination and metallization, and defines technology roadmaps.

Senior Engineer R&D - Patterning Process develops advanced circuit formation technologies for Glass Core Substrates. This role optimizes lithography, etching, and plating processes for high-density interconnect solutions.

TUI BLUE seeks a Receptionist to join its global flagship hotel brand. This full-time role supports a brand known for combining individual and all-inclusive holidays with high quality and modern facilities.

IT Security Engineer focuses on Security Operations & Incident Response and Identity & Access Management. Responsibilities include investigating security incidents and improving controls in Microsoft Entra ID and Active Directory.

Senior Expert R&D - Substrate & Packaging Industrialization will evaluate and transfer integration approaches for components requiring high-precision alignment. The role assesses feasibility under realistic production conditions and contributes to the development and realization of integration approaches.

Expert in photonics and optical integration will develop and evaluate electro-optical concepts for a multi-partner R&D project. Focus on co-design across optical, electrical, and packaging domains, ensuring feasibility under system-level and manufacturing constraints.

Principal Digital Verification Engineer requires 8+ years in Digital Design and Verification. Expertise in System Verilog, UVM, and coverage is essential. Must collaborate on verification strategy and documentation.

Drive growth and adoption of digitally enabled and AI-enhanced forensic solutions across Europe and APAC. This commercial role leads market activation, shifting teams to technology-led delivery and building go-to-market strategies.